Grade: 18.10 to 20.90

Reports To: VP Manufacturing

Background:

Founded in 1989, AMI’s work is found worldwide in building security systems, solar energy equipment, pharmaceutical equipment, aircraft instrumentation, industrial laser controls, medical devices, Internet-of-things devices, and a host of emerging products from high-tech startups.

Functions & Responsibilities:

• Develop product specific method packages for each required area of the manufacturing process
• Setup Bills of Materials (BOMS) and product flow in AMI’s ERP system
• Liaison with solder and solder paste suppliers
• Manage the company’s Change Notice and ECO process
• Lead and participate in value engineering activities to eliminate waste while producing our customer’s product
• Lead and participate in evaluations and assessments to identify corrective actions as required
• Engage in regular and routine communication with customers and internal support functions
• Teach AMI employees how to use LEAN tools to facilitate the elimination of waste throughout the process
• Lead in the introduction of new products in the manufacturing process
• Evaluation of assembly equipment

Educational Requirements:

• High School Diploma/GED
• Some postsecondary education preferred but not required (may be substituted by work experience)

Experience:

• Experience working with a CAD system, Photoshop, E-mail, digital camera use
• Experience working with Photoshop
• Experience in executing Lean Manufacturing techniques in a manufacturing environment

Skills Required:

• Self-starter and a strong problem solver
• Desire to work as a member of a team
• Experienced in a fast paced, dynamic environment.
• Intermediate Microsoft Office skills, specifically Excel, Word and Google sheets
• Working with a computer-based ERP/MRP system
• Ability to read, understand and work with bills of materials, gerber files, technical drawings, component data sheets
• Proficient with manufacturing tools and activities, such as 5S, Kaizen, Value Stream, Kanban systems, etc
• Proficient in understanding solder paste application and how it effects assembly of circuit boards including but not limited to screen printing, reflow profiles, and placement of component